Shenzhen NORCO Intelligent Technology Co., Ltd.

3U CompactPCI Modular Computer Based on Intel QM57 Chipset

3U CompactPCI Modular Computer Based on Intel QM57 Chipset
Product Detailed

1.Modular design, easy to maintain and enhance system expansibility
2.Adopt Intel Ibex Peak-M PCH,onboard Intel i5/i7 processor

System 

 

Motherboard

FLX-2000

Chipset

QM57

Processor

Onboard Intel i660UE/i620UE/i620LE processors

System Memory

1xDDRIII 1066/1333MHz SO-DIMM, supporting up to 4GB

BIOS

8M AMI EFI BIOS

Display

Display Port

1x VGA(DB15),1XHDMI

Chip

Processor Integrated+PI3VDP411LS

Resolution

2048x1536@60Hz

Multiple Display

Support VGA+HDMIdual independent display, expanded display

Storage

CF

1xCF supports Type II CompactFlash

SATA

4*SATAII via extension from the rear panel

I/0

Serail Port

1xRS232 via gusset plate extension

USB

10x USB2.0, four on the rear panel, two on the gusset plate, and two on the motherboard panel

LAN

Intel 82574L+82577LM, 10/100/1000Mbps,2xRJ45,

 wake-on-line and AMT6.0 supported

Audio

ALC887, 1x MIC-IN,2x Line-in and 2x Speakerout with 1XMIC,1Xspeakerout and 1XLINE-IN on gusset plate; 1XLINE-IN and 1Xspeakerout on rear panel

PS/2

2x4 PIN(for testing, recommeded to delete this option)

GPIO

16 bit GPIO (8 way via rear panel extension and 8 way on the Gusset plate )

Expansion Slots

6xPCIe 1X,1xPCIe 8X, with extension provided by rear panel

System Control

--

LED Indicator

Power/System Status LED,  LAN Card/HDD LED 

Power Supply

Rear panel provides power supply support

Cooling System

Passive cooling

O/S support

WIN XP/XP-E, WIN 2003/2008Server,WIN7, etc

Physical & Environmental

Operating Temperature

32°F~140°F(0°C~60°C)

Storage Temperature

 -40°F~176°F(-40°C~85°C)

Relative Humidity

5%~95%, 40°C, no-condensing

Vibration Test

0.5g rms/5~500Hz/random operation

EMC

CE/FCC Class A

FLX-2000 is a CompactPCI modular computer(non-standard signal define), 3U in height. This system adopts Intel i5/i7 processors based on Intel QM57 chipset. Onboard one SO-DIMM slot supports DDRIII 1066/1333MH RAM, max. up to 4GB . System modular design will meet the flexible I/O 

configuration requirements under various application conditions. No complex interior wiring parts makes the whole

 system easy to maintain and provides system more expansibility, radically reducing the unstability caused by wiring. 

With all the innovative features mentioned above, this product can be widely used in such crucial occasions as energy,

 military/aviation, industrial automation, transportation, etc. 

 



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